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Advanced Industrial Conference on Wireless Technologies ICW 2005 Week of August 14, 2005 - Montreal, Canada

Committees

ICW Advisory Committee
Petre Dini, Cisco Systems Inc., USA
Pascal Lorenz, University of Haute Alsace, France
Ivan Stojmenovic, SITE-University of Ottawa, Canada
Do van Thanh, Telenor R&D, Norway

ICW 2005 General Chairs
Alan Bernardi, Bell Canada, Canada
Petre Dini, Cisco Systems Inc., USA

ICW 2005 TPC Chairs
Said Soulhi, Ericsson Research, Canada
Soumaya Cherkaoui, University of Sherbrooke, Canada

ICW 2005 Tutorial Chair
Arkady Zaslavski, Monash University, Australia

Publicity Chair
Emilio Garcia-Palacios, Queen's University Belfast, N. Ireland, UK

Preliminary Technical Program Committee
Andrew Aftelak, Motorola UK Research, UK
Christer Åhlund, Luleå University of Technology, Sweden
Angeliki Alexiou, Lucent Technologies, UK
Stefano Basagni, Northeastern University, USA
Alan Bernardi, Bell Canada, Canada
José Marcos Brito, National Institute of Telecommunications, Brazil
Pedro Angel Cuenca Castillo, University of Castillia La Mancha, Spain
Alexander Clemm, Cisco Systems, Inc., USA
Todor Cooklev, San Francisco State University, USA
Marc de Courville, Université de Marne la Vallée, France
Ken Crisler, Motorola Labs, USA
J. Roberto B. de Marca, University of Rio de Janeiro, Brazil
José Neuman de Souza, UFC, Brazil
Wouter de Win, Agilent, France
Riadh Dhaou, Institut National Polytechnique de Toulouse, France
Petre Dini, Cisco Systems, Inc., USA / Concordia University, Canada
Nikos Dimitriou, National Kapodistrian University of Athens, Greece
Afonso Ferreira, CNR & COST Office, Belgium
Michael F. Finneran, dBrn Associates, Inc., USA
Emilio Garcia-Palacios, Queen's University Belfast, N. Ireland, UK
Silvia Giordano, University of Applied Science-SUPSI, Switzerland
Voicu Groza, University of Ottawa, Canada
Martin Haardt, Technische Universität Ilmenau, Germany
Pierre Henrio, Alcatel, France
Walter Hirt, IBM Zurich Research Laboratory, Switzerland
Yeong Min Jang, Kookmin University, Korea
Kevin Kahn, Intel Corporation, USA
Markus Kampmann, Ericsson GmBH, Germany
Merkouris Karaliopoulos, University of Surrey, UK
Inkyu Lee, Korea University, Korea
Dilip Krishnaswamy, Intel Corporation, USA
Victor O.K. Li, The University of Hong Kong, China
Mike Myung-Ok Lee, Dongshin University, Republic of Korea
Raymond Liao, Siemens TTB Center, USA
John Lodge, Communications Research Center (CRC), Canada
Pascal Lorenz, University of Haute Alsace, France
Matthias Lott, Siemens AG, Germany
Martin Maklin, TeliaSonera, Sweden
Mitsuji Matsumoto, Waseda University, Japan
Jelena Misic, HKUST, Honk Kong
Nikolai Nefedov, Nokia Research Center, Finland
Oluf Nielson, European Commission
Carlos E. Palau, Polytechnic University of Valencia, Spain
Adzislaw Papir, University of Mining and Technology, Poland
Kari Pehkonen, Nokia, Sweden
Panos Philippopoulos, Temagin SA, Greece
Christian Prehofer, DoCoMo Labs, Germany
Alejandro Quintero, École Polytechnique de Montréal, Canada
Kimmo Raatikainen, University of Helsinki, Finland
Lars Rasmussen, Chalmers University of Technology, Sweden
Jason Redi, BBN Technologies, USA
David Raymer, Motorola, USA
Joel J. Rodrigues, University of Beira Interior, Portugal
Emilia Rosti, Università degli Studi di Milano, Italy
Behcet Sarikaya, University of Northern British Columbia, Canada
Iwao Sasase, Keio University, Japan
Ichiro Satoh, National Institute of Informatics, Japan
Mamoru Sawahashi, NTT DoCoMo, Japan
Andreas Schieder, Ericsson, Germany
Sakir Sezer, Queen's University Belfast, N. Ireland, UK
Said Soulhi, Ericsson Research, Canada
Thomas Stidsen, Danish Technical University, Denmark
Ivan Stojmenovic, SITE-University of Ottawa, Canada
Kun Tan, Microsoft, China
Rahim Tafazolli, University of Surrey, UK
Kari Tilli, National Technology Agency, Finland
Dirk Trossen, Nokia Research, USA
Susumu Yoshida, Kyoto University, Japan
Mikko A. Uusitalo, Nokia Research Center, Finland
Mihaela van der Schaar, University of California - Davis, USA
Do van Thanh, Telenor R&D, Norway
Alessandro Vanelli-Coralli, University of Bologna, Italy
Vijay K. Varma, Telcordia Technologies, USA
Enrique Vasquez, Technical University of Madrid, Spain
Josep Vidal, Polytechnic University of Catalonia
Michele Visciola, Politecnico di Milano, Italy
Arkdy Zaslavski, Monash University, Australia
Hans-Jürgen Zepernik, Blekinge Institute of Technology, Sweden
Wang Wenbo, Beijing University of Posts and Telecommunications, China