The Eleventh International Conference on Advances in Circuits, Electronics and Micro-electronics

CENICS 2018

September 16, 2018 to September 20, 2018 - Venice, Italy

Deadlines

Submission

Apr 30, 2018

Notification

Jul 02, 2018

Registration

Jul 16, 2018

Camera ready

Jul 22, 2018

Publication

Published by IARIA XPS Press

Archived in the free access ThinkMind Digital Library

Prints available at Curran Associates, Inc.

Authors of selected papers will be invited to submit extended versions to a IARIA Journal

Affiliated Journals

CENICS 2018 - The Eleventh International Conference on Advances in Circuits, Electronics and Micro-electronics

September 16, 2018 - September 20, 2018

CENICS 2018

ISSN: 2308-426X
ISBN: 978-1-61208-664-4

Indexing

  • Conference proceedings and Journals are indexed by the Library of Congress of the United States (ISSN numbers)
  • Conference proceedings are sent for indexing to ISI Thomson Reuters by Filodiritto/InFOROmatica Publisher, Italy
  • IARIA Journals are sent for indexing to ISI Thomson Reuters by Filodiritto/InFOROmatica Publisher, Italy

CENICS 2018 is colocated with the following events as part of NetWare 2018.

  • SENSORCOMM 2018, The Twelfth International Conference on Sensor Technologies and Applications
  • SENSORDEVICES 2018, The Ninth International Conference on Sensor Device Technologies and Applications
  • SECURWARE 2018, The Twelfth International Conference on Emerging Security Information, Systems and Technologies
  • AFIN 2018, The Tenth International Conference on Advances in Future Internet
  • CENICS 2018, The Eleventh International Conference on Advances in Circuits, Electronics and Micro-electronics
  • ICQNM 2018, The Twelfth International Conference on Quantum, Nano/Bio, and Micro Technologies
  • FASSI 2018, The Fourth International Conference on Fundamentals and Advances in Software Systems Integration
  • GREEN 2018, The Third International Conference on Green Communications, Computing and Technologies

        Selected authors of presented articles will be invited to submit extended versions to the following journals:

     

CENICS 2018 conference tracks:

Trends on hot research/industrial areas

Low-energy devices;  Energy-efficient systems;  Smart grids; Power line communication systems; Eco-batteries; Batteries and hybrid voltage suppliers; Picowatt-aware voltage devices; Self-sustaining wireless power transfer systems; High-efficiency power amplifiers; Voltage scaling applications; Internet of Things (IoT) devices; Smart building systems; Low-latency arbiters; Feedback topologies; Atmospheric turbulence-agnostic systems; Ultra-wide-band analog-to-digital converters; Audio or image signal reconstruction; Very high frequency front-end components; 5G small-cell structured mobile networks; Heterogeneous optical networks; 5G wireless and mm-Wave systems; Cognitive radars; Signal processing for crowd dynamics; Small-scale prosumers; Deep learning in compressed sensing; Biometric authentifiers; Quantum cellular automata; Cognitive communication

Semiconductors and applications

Special semiconductors; Tunable bandgap semiconductors; Piezoelectricity; Polarization; Breakdown voltage; Superconductivity; Ferromagnetism; Biocompatibility; Chemical and thermal stability; Power amplification at very high frequencies; High temperature electronics; LEDs and lasers; Photodetectors; Transistors; Piezoelectric filters

Design, models and languages

Languages and models for specification and design of hardware; Robust, reliable and/or safe embedded electronics; Circuits/hardware description languages; Standards related to design languages; Processor and memory design; Embedded system design; VHDL-related standards; Electronic circuits modelling; Automatic generation of models; Quantitative analysis of models; Distributed CAD systems; Collaborative design based on Internet and WWW; Electronic systems design based on WWW; System- and high-level synthesis, HW/SW codesign

Signal processing circuits

Signal processing; High-speed signal processing; Multi-scale signal processing and imaging; Asynchronous circuits and systems; High frequency processing; Power and signal amplifiers; Parallel processing circuits; Equalization processing; Compression, transcoding, and applied signal processing

Arithmetic computational circuits

Operational arithmetic circuits; Basic arithmetic operations; Modular operations; Decimal-floating point operations; Multiple-precision operations; Squaring and exponentiation; Polynomial evaluations; Periodic functions; Operational approximations; Parallel decimal operations

Microelectronics

Components and circuits for communications; HMIC and MMIC design; Micro-electronics; Nano-electronics; Lasers and mini-lasers; Miniature devices; Low power electronics; Nano-scale electronics materials

Electronics technologies

Organic optoelectronic; Implantable electronics; Wearable electronics; Low power electronics; Electronic microarray technology and applications; RF and Microwave

Special circuits

Programmable circuits; Design of reconfigurable micro-chips; VLSI circuits design; Low-noise circuits; Digital modulators; Micro-sensors; Micro-antennas; Thermal circuits; Reconfigurable circuits; Dynamically reconfigurable processors; Oscillators; VCOs and phased-array transmitters

Consumer electronics

Home-oriented electronics; Biometric circuits; Home gateway; Home theater circuitry; Game systems; Interactive and directed programming electronics; Advanced DVD and CD; Interactive and directed programming electronics

Application-oriented electronics

Medical Applications including telemedicine and eHealth electronics; Biochip design for health science applications; Bio-systems and miniature instruments; Biosensors and biosensor networks; Power and energy distribution electronics; Electronics for building automation; Energy saving and conversion circuits; Industrial measurement and control electronics; Electronics for Avionics, Automotive, Railways and Industrial Applications; Navigation electronics


Deadlines:

Submission

Apr 30, 2018

Notification

Jul 02, 2018

Registration

Jul 16, 2018

Camera ready

Jul 22, 2018

Technical Co-Sponsors and Logistic Supporters