The Eighteenth International Conference on Sensor Technologies and Applications

SENSORCOMM 2024

November 03, 2024 to November 07, 2024 - Nice, France

Deadlines

Submission

Aug 16, 2024

Notification

Sep 18, 2024

Registration

Sep 26, 2024

Camera ready

Oct 04, 2024

Deadlines differ for special tracks. Please consult the conference home page for special tracks Call for Papers (if any).

Publication

Published by IARIA Press (operated by Xpert Publishing Services)

Archived in the Open Access IARIA ThinkMind Digital Library

Prints available at Curran Associates, Inc.

Authors of selected papers will be invited to submit extended versions to a IARIA Journal

Indexing Procedure

Affiliated Journals

SENSORCOMM 2024 - The Eighteenth International Conference on Sensor Technologies and Applications

November 03, 2024 - November 07, 2024

SENSORCOMM 2024: Awards
Onsite and Online Options: In order to accommodate a large number of situations, we are offering the option for either physical presence or virtual participation (pdf slides or pre-recorded videos).

The papers listed below have been selected as "Best Papers" based on the reviews of the original submission, the camera-ready version, and the presentation during the conference. For the awarded papers, a digital award will be issued in the name of the authors. The authors of these papers are also receiving invitations to submit an extended article version to one of the IARIA Journals.

 

Awarded Papers (also Invited for IARIA Journals)

Easy-to-use Wireless Sensor Network Simulator for Estimating Power Consumption and Communication Availability
Yuta Hosokawa, Minoru Tanaka, Kazuki Nakamura

 

The following papers have been selected on the basis of their contents, specificaly for lending themselves to an interesting extended work. The authors of these papers are receiving invitations to submit an extended article version to one of the IARIA Journals.

Papers Invited for IARIA Journals

NNEPS: Network-Updated E-Paper Signage with Reduced Standby Power Consumption
Takafumi Akiba, Tsubasa Yumura

 

Technical Co-Sponsors and Logistic Supporters